2025, Japan, Tokyo, IC and Sensor Packaging Technology Exhibition, Time and Venue

IC & SENSOR PACKAGING TECHNOLOGY EXPO in Tokyo, Japan is the leading packaging technology trade show in Japan. It is an exhibition dedicated to showcasing semiconductor/sensor and other electronic device packaging technologies.

IC & SENSOR PACKAGING TECHNOLOGY EXPO in Tokyo, JapanThis is a good place for business discussions with engineers from the semiconductor and sensor industry such as semiconductor, sensors, electronic equipment, automotive and other industries.(The copyright of this article belongs to Juzhan, and no transmission is allowed without consent)

IC & SENSOR PACKAGING TECHNOLOGY EXPO in Tokyo, JapanThe total area of ​​the last exhibition was 16,000 square meters. There were 375 exhibitors from China, South Korea, Taiwan, India, Thailand, Malaysia, Singapore, Turkey, Germany, etc., and the number of exhibitors reached 18,240. The exhibition is highly professional and achieves good business results, attracting many high-tech equipment enthusiasts, users and industry visitors.

Scope of the exhibition:

Equipment, packaging materials/components, IC packaging analysis/simulation software, semiconductor test devices/equipment

SATS/Contractual Design Services, Electroplating/Etching Materials and Equipment, MEMS Packaging Equipment/Equipment (The copyright of this article belongs to Juzhan, and no transmission is allowed without consent)

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References:

Japan IC and Sensor Packaging Technology Exhibition in Tokyo

IC AND SENSOR PACKAGING TECHNOLOGY EXPO

Accommodation area: Japan

Exhibition date: January 22, 2025 – January 24, 2025

Opening and closing hours: 09:00-18:00

Accommodation address: 3-21-1 Ariake, Koto-ku, Tokyo 135-0063, Japan

Exhibition area: 16000

Number of viewers: 18240

Detention period: once a year

Organizer: Reed Exhibitions