Silicon photonic chips used for quantum computing operate at temperatures of several kelvins. This makes it challenging to connect the necessary single-mode optical fibers. Typical epoxy bonding methods cannot create a stable connection, especially when multiple cooling cycles are required.
Selective laser soldering provides a more robust connection that withstands repeated temperature cycles. The VersaSolder system from nanosystec is ideal for connecting multiple optical fibers to this type of silicon photonic chip. Two optical heads focus the laser beam to the connection point and re-solder the solder. After the laser power is reduced, the solder cools and forms a stable connection. The symmetrical configuration with two simultaneous beams avoids misalignment during assembly.
Compared to epoxy gluing, the laser welding method saves time because placing the fiber and welding takes only a few seconds. Therefore, laser welding can also achieve higher production throughput.
The VersaSolder system has a modular architecture and can be configured to meet the requirements of specific process development and manufacturing operations.
Exhibition reference: nanosystec will be at ECOC in Frankfurt (September 23-25, 2024).
About nanosystec
nanosystec designs and builds high-precision assembly and test stations. These systems use precise motion control and joining technologies such as precision laser welding, laser soldering and UV-cured micro-gluing. Precision cutting and fine balancing complete the product portfolio. These systems are used worldwide in optoelectronic and medical applications, the automotive industry and aerospace.
Nanosystems Technologies Ltd.
6 Marie Curie Avenue
64823 Groß-Umstadt
Tel: +49 6078 782540
www.nanosystec.com
sales@nanosystec.com
August 7, 2024
For any editorial questions, please contact me directly: christiane.hummelt@nanosystec.com
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