OSFP-VLC connector for vertical line cards
Yamaichi developed OSFP-VLC, a vertical version of the OSFP connector that is compatible with vertical line card platforms. The VLC architecture achieves higher density and higher transmission speeds through vertical line cards, which install vertical I/O connectors and ASICs side by side, shortening the signal routing distance to within 3 inches to 4 inches. At the same time, existing technologies (modules, circuit board assembly processes, signal transmission) are utilized. VLC reduces the number of boards and frees up space for cooling. This significantly reduces power consumption and improves cooling efficiency. 112G can be achieved at the current cost. More information
Molex Launches Versatile VaporConnect Optical Feedthrough
First-to-market boxed two-phase immersion cooling solution significantly reduces the time and cost required to install and upgrade hyperscale data centers Plug-and-play deployment easily connects submersible optical transceivers to cabling infrastructure via fully upgradeable sealed modules Future-proof capabilities include the flexibility to change connector types and adjust circuit configurations without impacting mechanical interfaces or tank design Molex, a global electronics leader and connectivity innovator, today introduced a thermal management solution that reduces the time and cost of deploying and upgrading high-performance data centers to meet the continued demand for generative AI and machine learning workflows. The Molex VaporConnect™ optical feedthrough module for two-phase immersion cooling utilizes a unique box design that bolts directly to the immersion tank, allowing the replacement of optical transceivers and network cabling infrastructure without changing the mechanical interface or affecting the immersion tank architecture, thereby addressing the increasing speed and capacity of data centers. Reference designs for the new modules will be commercially available in the first…
1948RUB 700 mW Increased C-band output power and
3SP Technologies, one of the leading suppliers in the Raman pump market, has announced the launch of its new generation of 14xxnm Raman pump laser modules, enabling up to 700mW of pump laser power at a maximum power consumption as low as 11W. 3SP Technologies, with its 30 years of experience in InP-based pump laser technology, brings to the market a new high-performance Raman 14xxnm pump laser module: the 1948RUB. Over the last decades, we have witnessed an increase in the capacity requirements of optical transmission systems, due to the huge amount of data exchanged worldwide. Thanks to optical amplifiers using high-power pump lasers, very high rates can be transmitted over long distances in optical networks via optical fibers. The 1948RUB offers up to 700 mW output power to improve the optical signal-to-noise ratio (OSNR) at the receiver end. 3SP Technologies has developed a new advanced laser chip using an existing fully Telcordia-compliant packaging platform, which has been significantly improved…
HYC will showcase next-generation multi-core fiber and AI data centers
ECOC 2024 will be held in Frankfurt, Germany from September 23 to 25. This year, HYC will showcase some groundbreaking innovations. As the rise of AIGC and large language models drives unprecedented growth in data processing needs, HYC will showcase advanced solutions designed to meet these challenges. Highlights include multi-core fiber connections for next-generation networks, silicon photonic module connections, and AI data center connections to support the massive data transmission and ultra-low latency requirements essential to AI data centers. Multi-core Fiber Subassemblies for Next-Generation Connectivity Optical communication networks have a growing demand for increased capacity. Affected by the nonlinear Shannon limit, optical fiber capacity has reached its limit. Multi-core optical fiber using space division multiplexing (SDM) technology is expected to be the best choice to break through the limit. HYC has developed a series of multi-core optical fiber components for next-generation connections. 1) 4CH/7CH/8CH multi-core fiber LC/FC type fiber optic connectors solve the problem of difficult on-site splicing of MCF…
Leveraging the new generation
Coherent multi-source agreement (MSA) pluggable modules have played a key role in expanding deployment scenarios for network operators, and the introduction of 400G modules has driven near-term network transformation opportunities. We have seen the introduction of various 400G MSA pluggable products drive the adoption of recent IP-over-DWDM architectures, enabling direct router-to-router metro connections over fiber and higher port density transponder designs. The Optical Internetworking Forum (OIF) launched the 400G MSA pluggable generation and developed the 400ZR implementation agreement, enabling point-to-point amplified links up to 120 km running at 60+Gbaud data rates. Around the same time frame, the OpenROADM MSA defined 400G interfaces for ROADM networks and extended reach; the OpenZR+ MSA leverages these higher performance interfaces to enable interoperable enhanced performance links for 400G pluggable modules (Figure 1). The introduction of high transmit optical power (>0dBm) ZR+ modules, such as Acacia’s Bright 400ZR+ module, further expands the 400G MSA pluggable space to include brownfield ROADM network architectures (existing transponder channels…
InP-based chip technology | ECOC
The Sumitomo Electric global team looks forward to participating in the 2024 ECOC exhibition. Sumitomo Electric Industries, Ltd. is a well-known Japanese company with a history of more than 120 years and a pioneer in the research and development of high-tech products and systems. It will showcase a host of innovative products, cutting-edge technologies and comprehensive solutions designed to enable high-speed, high-capacity communications. The exhibition will include: InP-based chip technologies. This includes high-power CW (continuous wave) lasers and EML (electro-absorption modulator integrated laser diode). It will also provide scalable coupling solutions to bridge the gap between optical fibers and PICs (Photonic ICs). Its team of experts will showcase the company’s latest line of core alignment, cladding alignment and ribbon fiber splicers, all featuring its proprietary NanoTune™ technology that optimizes splice losses caused by poor fiber cleavage. In its fiber optic product portfolio, Sumitomo Electric Industries, Ltd. is pleased to highlight the Z-PLUS™ ultra-low-loss multi-core fiber (MCF), which has been Finalist…
Micro-armored cables in data centers: TiniFiber goes into service
Lindenhurst, New York, September 23, 2024 — TiniFiber, the exclusive manufacturer of the U.S.-patented and UL-listed TiniFiber Micro-Armor fiber optic cable solutions, has begun in-house production of pre-terminated MPO (multi-fiber push-on) cable assemblies, simplifying and speeding up the installation of the manufacturer’s crush-proof fiber optic cables in data centers. MPO connectors integrate multiple fibers to support data centers, including AI and encrypted data centers that require high-density data. They support parallel optics: applications that transmit and receive signals over multiple fibers to achieve higher speeds. Micro Armor is 65% smaller and 75% lighter than traditional armored alternatives, and its pre-terminated MPO cable assemblies are tested and verified to comply with international standards such as IEC 61754-7 and EIA/TIA-604-5 (FOCIS 5), which specify the physical properties and performance of connectors and ensure interconnection with all compliant cables and connectors. “MPO pre-terminated cable assemblies play a vital role in reducing labor costs for data center installations because they eliminate the need for…
Ciena Launches 1.6 Tb/s Coherent Pluggable Solution
Coherent-Lite products improve the scalability, efficiency and performance of data center and campus networks to handle the growing volume of traffic from the cloud, machine learning and AI Ciena continues to push the boundaries of technology, bringing to market the 1.6 Tb/s Coherent-Lite pluggable product to help cloud and data center providers address the expected growth in cloud, machine learning and artificial intelligence (AI) related traffic. To meet the needs of high-performance data center architectures and campus applications, Ciena's industry-leading WaveLogic 6 Nano (WL6n) will now offer 1.6 Tb/s and 800G coherent pluggable solutions. The 3nm coherent ASIC used in the WL6n enables a 1.6 Tb/s Coherent-Lite pluggable solution by supporting dual 800G data paths within a single DSP chip. Coherent-Lite refers to a coherent design optimized for power and latency for shorter reach data center applications. “The rapid adoption of AI and machine learning applications will create a new wave of bandwidth demand around the world,” said Dr. Vlad…
New Product – Advanced Desktop Inspection Microscope
The VIAVI FVAM-2000 benchtop microscope democratizes AI/ML with fast, versatile, and automated transceiver inspection. It provides high-contrast images and faster panning performance, complete software analysis, and optimized lighting tools. This new microscope utilizes unique optical adapters to manage complex installations of pluggable optical transceivers with or without long pull tabs while addressing ergonomic challenges. The FVAM-2000 supports MPO and other new bulkhead connectors designed for 800G formats, such as OSFP and QSFP, which are driving industry growth today. It also comes with an advanced automation framework for integration into PC-driven workflows.
NewPhotonics Launches NPG102 Transmitter-on-Chip
Optical transmitters with integrated lasers enable innovation in all-optical transceivers for networking and computing infrastructure Tel Aviv, Israel Sept. 19, 2024 /PRNewswire/ — NewPhotonics Ltd., a leader in advanced integrated photonics technology, today launched the 1.6Tbps NPG102 PIC transmitter-on-chip (TOC) for DSP-based optical transceiver modules. The NPG102 TOC provides low-latency data communications with low power consumption and low channel loss to meet the growing AI cluster processing needs of data center infrastructure. NewPhotonics NPG102 PIC-on-chip transmitter for 1.6Tbps DSP-based modules The optimized flip chip integrates eight channels, auto-tuning lasers and 224Gbps PAM4 modulation, with 1.6Tbps of aggregate bandwidth and electro-optical transmission. The internal ADC/DAC supports channel control and monitoring in the package, with on-chip temperature monitoring, and power consumption as low as 2.9W. Integrated lasers shorten module time to market The monolithically integrated laser and modulator are designed for pluggable OSFP modules, increasing system integration through wafer-level laser alignment and integrated direct modulation. The added benefit of all-optical innovation in…
Samtec to Participate in Interoperability Demonstration and Exhibit
As part of the OIF interoperability demonstrations, Samtec products will be on display in booth #D2 and in the OIF booth #B83. September 18, 2024 (New Albany, IN) – Samtec, Inc., a leader in serving the connector industry, will showcase next-generation, high-performance optical and copper interconnect solutions at the upcoming ECOC, Europe’s largest optical communications exhibition. ECOC, which will be held in Frankfurt, Germany, September 23-25, 2024, will also feature the OIF Interoperability Demonstration, showcasing products and technologies that will be critical to shaping industry standards over the next decade. Samtec is one of 34 member companies participating in the OIF Demonstration, which will focus on advancements in performance, efficiency, and capacity to meet the needs of future-proof data centers, AI/ML technologies, and disaggregated systems. OIF demo companies will showcase innovations in 800ZR, 400ZR, and multi-span optics, Energy Efficient Interfaces (EEI) and co-packaging, 224G and 112G Common Electrical I/O (CEI), and Common Management Interface Specification (CMIS). Samtec Networking Solutions Booth…
Eoptolink launches OSFP 1.6T DR8 and 2FR4 series
Chengdu, September 20, 2024 – Eoptolink Technology Co., Ltd. (SZSE: 300502), a leading innovator and provider of optical transceiver solutions, announced the launch of its OSFP 1.6T DR8/DR8-2 and 2xFR4 transceivers to enable next-generation high-bandwidth networks for AI/ML clusters and cloud data centers. Eoptolink 1.6T OSFP transceivers feature 8 electrical host interface channels and 8 optical channels operating at 212.5Gb/s (106GB with PAM4). These modules are equipped with the industry's latest DSP and support transmission distances up to 2 km without regenerating FEC. The 1.6T DR8 and DR8-2 modules are equipped with one MPO-16 adapter for point-to-point (P2P) connections or two MPO-12 adapters for 2x800G breakout applications. The 1.6T 2xFR4 module is designed with a duplex LC connector and uses only 2 pairs of optical fibers, which can help users save fiber resources compared to the DR8 and DR8-2 versions. The 1.6T DR8/DR8-2 and 2FR4 portfolio includes: –EOLO-13T-5H-XMX OSFP 1.6T DR8, 1×1.6TbE, 500 meters, MPO-16EOLO-13T-5H-XDX OSFP 1.6T DR8, 2x800GbE, 500m,…
Silicon photonic chips for quantum computing need stable
Silicon photonic chips used for quantum computing operate at temperatures of several kelvins. This makes it challenging to connect the necessary single-mode optical fibers. Typical epoxy bonding methods cannot create a stable connection, especially when multiple cooling cycles are required. Selective laser soldering provides a more robust connection that withstands repeated temperature cycles. The VersaSolder system from nanosystec is ideal for connecting multiple optical fibers to this type of silicon photonic chip. Two optical heads focus the laser beam to the connection point and re-solder the solder. After the laser power is reduced, the solder cools and forms a stable connection. The symmetrical configuration with two simultaneous beams avoids misalignment during assembly. Compared to epoxy gluing, the laser welding method saves time because placing the fiber and welding takes only a few seconds. Therefore, laser welding can also achieve higher production throughput. The VersaSolder system has a modular architecture and can be configured to meet the requirements of specific process…
ECOC 2024: 800G, 1.6T… (and AI, of course)
The 2024 European Conference on Optical Communications (ECOC) takes place next week, and AI is expected to be a hot topic again as people continue to think about where AI will have the biggest impact and how network operators can ensure they are ready to future-proof their networks to handle the expected surge. In addition to AI, there are also exciting and coherent technical developments in pluggable interoperable interfaces for 800G and 1.6T. These topics will also be top of mind at the show as the industry discusses how to make these transitions as smooth as we saw with 400G. The Impact of AI on Optical Transport NetworksWhile recent attention on high-capacity interconnects for AI applications has been focused on short-reach connections within AI clusters, the industry is already seeing bandwidth demands begin to increase, requiring additional coherent connections between AI-enabled data centers. While it is widely accepted that the bandwidth demands created by AI applications will lead to increased…
ECOC 2024: 800G, 1.6T… (and AI, of course)
The 2024 European Conference on Optical Communications (ECOC) takes place next week, and AI is expected to be a hot topic again as people continue to think about where AI will have the biggest impact and how network operators can ensure they are ready to future-proof their networks to handle the expected surge. In addition to AI, there are also exciting and coherent technical developments in pluggable interoperable interfaces for 800G and 1.6T. These topics will also be top of mind at the show as the industry discusses how to make these transitions as smooth as we saw with 400G. The Impact of AI on Optical Transport NetworksWhile recent attention on high-capacity interconnects for AI applications has been focused on short-reach connections within AI clusters, the industry is already seeing bandwidth demands begin to increase, requiring additional coherent connections between AI-enabled data centers. While it is widely accepted that the bandwidth demands created by AI applications will lead to increased…
Future-oriented AI transmission network
With the rise of generative artificial intelligence (AI) applications and the large-scale construction of AI infrastructure, the optical industry is at the forefront of this development, as improved optical interconnects can alleviate bandwidth limitations within AI clusters. This was one of the hottest topics at OFC 2024, and LightCounting predicts that total sales of optical transceivers for AI cluster applications could reach approximately $52 billion in the next five years (Figure 1). Figure 1. AI Cluster Ethernet Optical Transceiver Sales Forecast (LightCounting Newsletter, “AI Optics Soft Landing?”, July 2024). While the near-term focus is on how AI will impact short-distance interconnect technologies, in hyperscale networks it will certainly have an impact on interconnect beyond AI clusters and AI data centers. The question is: Beyond short-distance high-bandwidth interconnects, how will AI traffic impact the optical transport environment beyond in-building networks and the metro, long-haul, and long-haul applications that make heavy use of optical coherent transport? Bandwidth-intensive computation is attributed to both…
Molex Launches Next-Generation Fiber Optic Network Solutions
Molex is revolutionizing the AI landscape by transforming fiber optic network infrastructure to deliver unprecedented bandwidth and data center efficiency. By enabling next-generation fiber optic networks, Molex provides advanced solutions for AI that accelerate data transfer and simplify connectivity. Molex's comprehensive portfolio offers fiber optic connectivity, optoelectronic components and wavelength management solutions for next-generation networks. This shift not only increases the speed and reliability of data-driven artificial intelligence applications, but also ushers in a new era of digitalization. Molex specializes in cutting-edge optical technologies to advance network communications to meet the needs of tomorrow's high-speed digital world. More information
View Pro Manager – Setting New Standards
INNO Instrument's View Pro Manager is a cloud-based splicer management software that sets new standards with its unique features. Unlike other software, it provides unparalleled control and insight into splicing operations, revolutionizing the way technicians work in the field. View Pro Manager's advanced features, such as real-time data analysis, remote monitoring, and comprehensive management, revolutionize traditional field operations by significantly improving accuracy and efficiency. The tool enables seamless communication between field technicians and management, reducing errors, minimizing downtime, and ensuring high-quality splicing. INNO Instrument is truly reshaping the industry, making fiber fusion splicing more reliable, efficient and future-proof. More information
Connect your data center and grow at scale with the new NCS
Connect your data center and get a dramatic boost in your network and computing capabilities. The Cisco NCS 1014 platform, with 2.4T line cards powered by Coherent Interconnect Modules 8, is designed to meet these challenges and more. This new platform features a compact, modular form factor that can be placed in data centers and central offices. With full lifecycle automation and real-time visibility, industry-leading energy efficiency, enhanced resiliency features, and best-in-class security, the NCS 1014 delivers best-in-class performance for metro, long-haul, and submarine applications while being easy to deploy and manage. Visit Cisco booth B133.
New Optokon OTDR | Ecology Committee
OPTOKON's MOT-200 is an ultra-slim portable test device designed for high-performance field work. Measuring only 160 mm x 80 mm x 18 mm, this compact device has a 4.95-inch capacitive multi-touch screen and a built-in operating system for smooth operation. It features a one-button auto-test function, event map function, and integrated OLS/OPM/VFL modules, includes an RJ45 cable tester, supports storage of more than 1,000 test results, and provides professional PC software to generate detailed reports. Data transmission is carried out via USB Type-C and is powered by a rechargeable lithium battery, ensuring reliable performance under extreme conditions. More information
PhotonFirst’s fully automated PIC test
To help customers develop PIC-based solutions, PhotonFirst provides fully automated PIC testing capabilities. This service has the following three benefits:• Rapid prototyping – we understand the value of fast iterations to quickly learn and improve designs• Flexibility – ability to optically/electrically/thermally condition and probe the chip and characterize chip KPIs• Automation – Collecting large data sets in a controlled and timely manner More information
800G ZR+ Coherent Pluggable Transceiver
High-Performance Pluggable 800G Modules for DCI and Beyond: Lumentum 800ZR+ transceivers are ideal for a variety of applications, including expanded use in metro and regional networks by connecting directly to routers. In addition, enhanced performance modes now enable 400ZR+ and 600ZR+ operation for true long-haul applications, with OSNR and dispersion tolerance enabling 400 Gbps transmission distances exceeding 2,000 km.To see a live demonstration, visit booth #A24 More information
Suncall now launches 1.6mm LC pull-on connector
Suncall America's newest LC connector, the LC Pull Uniboot, now reduces cable footprint by using 1.6mm cable. This connector features a reinforced pull sleeve design that allows for easy insertion and removal from high density panels (no tools/tabs required). To save time in the field, polarity can be changed quickly without tools or exposing the fiber to external contaminants. Another added benefit of this connector is that it can be used opposite VSFF Pigtail or Patchcord. Stop by their ECOC booth C71 for a quick demo of this durable and compact connector. More information
Nanoscribe Training Courses | ECOC
Join us for a Free Space Micro-Optical Coupling (FSMOC) training event tailored for the photonic integration community. Learn how to easily achieve photonic coupling using in-situ printed micro-optics. Explore Aligned Two-Photon Lithography (A2PL®) and master Two-Photon Grayscale Lithography (2GL®) for precise optical printing on fiber or chip. High-precision inspection: fiducials, fiber cores, waveguides, and more. Align and print high-precision, freeform 3D optics with outstanding optical quality. Participate in hands-on live printing, create 3D scenes, and discover low-loss optical interconnect solutions for a variety of applications, including quantum technologies, LiDAR, PIC, telecommunications, and sensors. Register Here
VPIphotonics Design Suite Update Advances Simulation
VPIphotonics Design Suite includes professional application-specific simulation tools and additional toolkits for photonic components and optical transmission systems. Version 11.5 expands these tools and adds flexibility for high-demand emerging applications by streamlining usability, design flow and data analysis. Version 11.5 significantly improves simulation and design workflows for a wide range of applications, including next-generation direct detection and coherent transmission systems, space division multiplexing using multicore fiber, free-space optics for satellite communications, and more. These software solutions play an important role in the success of research and design projects of leading commercial companies and educational institutions. More information
Smallest pocket power meter tester
The PM 215E optical power meter is a compact, cost-effective tool ideal for field equipment. Despite its small size, it offers powerful functionality as a pocket power meter and USB probe for test stations. It can be placed in a rack-mounted ODF with the display located on the top or on the side. It is powered by a long-lasting lithium polymer rechargeable battery that ensures up to two years of operation. The device supports SM and MM fiber testing with more than 20 operating wavelengths and provides absolute and relative power measurements. It has an internal memory for 100 measurement results and can be easily uploaded via USB-C for control, charging and data transfer. More information
MPO 16F adapter with internal baffle and SC package
Suncall America's MPO 16F Internal Shutter Adapters offer a variety of benefits. These unique adapters are currently available in simplex and duplex models. Internal bezels allow for front-of-rack use, provide fast VFL detection and protect against laser exposure and dust/debris. From an environmental perspective, internal bezels require fewer dust covers during shipping, reducing plastic waste. SC footprint makes integration into current LC and SC panels quick and easy without modifying panel cutouts. Suncall will be demonstrating these adapters at ECOC booth #C71. Visit SuncallAmerica.com for more information
Performance pluggable – More modes, more applications.
Ciena's WaveLogic™ 5 Nano (WL5n) family includes a complete set of interoperable and extended-range 100G-400G coherent pluggable transceivers that deliver the power, space, and modularity benefits of pluggable devices in a variety of applications. Users can select fit-for-purpose pluggable devices for 400G metro Data Center Interconnect (DCI), converged IP/optical deployments, edge network capacity upgrades, or optical network modernization as needed. Innovative WL5n features such as probabilistic constellation shaping, embedded amplification, and the highest baud rate (70GBd) are all housed in a compact pluggable form factor to significantly improve network efficiency. All WL5n QSFP-DD pluggable devices are designed for simple deployment on third-party host platforms in any type of line system, are fully CMIS compliant, and are available in low and high Tx output power options. More information
OSFP-VLC Connector for Vertical Line Cards
Yamaichi developed the OSFP-VLC, a vertical version of the OSFP connector that is compatible with vertical line card platforms. The VLC architecture achieves higher transmission speeds and higher density through vertical line cards, which install vertical I/O connectors and ASICs side by side, shortening the signal routing distance to within 3 inches to 4 inches. At the same time, it makes full use of existing technologies (modules, circuit board assembly processes, signal transmission). VLC reduces the number of circuit boards and frees up space for heat dissipation, which greatly reduces power consumption and improves heat dissipation efficiency, making 112G possible at current costs. More information
OFS-95S Core Alignment Fusion Splicer
◆ 5-inch color touch screen◆ 6 motor core alignment◆ Automatic fiber identification (SMF/MMF/DSF/NZDSF/BIF/CSF)◆ Welding time: ≤7s, heating time: ≤18s◆ Estimated splicing loss: MMF ≤ 0.01dB, SMF/BIF ≤ 0.02dB, DSF/NZDFS/EDF ≤ 0.04dB, CSF ≤ 0.02dB,◆ Universal/replaceable 4-in-1 optical fiber bracket◆ SOC welding and heating support◆ Automatic welding and heating◆ High capacity battery, 200+ welding and heating cycles◆ Compact size: 125*125*135mm◆ Light weight: ≤1.8kg (including battery) More information
Booth B60
Accelink's OPU is an innovative, compact optical sensor processing unit that integrates the optical path, data acquisition, and demodulation functions into a single lightweight module. It uses fiber optic cables to simultaneously sense and detect long-distance vibration, temperature, strain, and attenuation without blind spots. The OPU is more than 90% smaller than similar devices, making it easier to integrate into a variety of applications. It targets industries such as smart grids, telecommunications, oil and gas, transportation, construction, and earthquake monitoring, providing efficient solutions for complex optical sensing networks. More information The post Stand B60 appeared first on ECOC.
Ciena study explores impact of artificial intelligence on networks
Ciena recently released a global study on the growing optimism among communications service providers (CSPs) about artificial intelligence (AI). The study, conducted in partnership with Censuswide, surveyed more than 1,500 CSP engineers and managers in 17 countries around the world. A key theme of the study is that AI will improve network performance. More than half (60%) of respondents believe AI can improve network efficiency by 40% or more, and 85% expressed confidence in CSPs’ ability to monetize AI traffic through the network. Additionally, CSPs believe AI will require upgrades to optical network infrastructure, switches, routers, and 800G technology. More information
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