How 3D and 2.5D IC packaging solutions enhance electronics

Compared to traditional packaging methods, 3D and 2.5 ICS offer more compact form factors and minimize power consumption, which is important for mobile devices and other space-constrained applications. Key players in the market are focused on adopting inorganic growth strategies such as acquisitions and mergers to develop advanced technologies for manufacturing 3D IC and 2.5D IC packaging, which is expected to drive the global 3D IC and 2.5D IC packaging market during the forecast period.

Also Read: How Semiconductor Packaging Shapes Tomorrow’s Technology

3D IC and 2.5D IC packaging market: improving semiconductor capabilities

2.5D and 3D packaging technologies are used to package multiple integrated circuits in a single package. To achieve very high chip-to-chip connection density, two or more active semiconductor chips are arranged side by side on a silicon interposer in a 2.5D configuration. Chip stacking is used in 3D structures to incorporate active chips for the shortest connections and smallest package footprint. In recent years, 2.5D and 3D have become increasingly popular as optimal chiplet integration* platforms due to their advantages in achieving very high packaging density and good energy efficiency.

2.5D and 3D packaging technologies are cutting-edge methods for improving the efficiency, functionality and performance of semiconductor devices. To create a three-dimensional structure, many layers of silicon wafers or chips are stacked vertically in a 3D IC package. Thanks to this stacking, logic, memory and analog integrated circuits (ICs) can all be integrated into a single package. Allows greater functionality in a smaller package. Improve performance by shortening interconnections between layers, thereby shortening the time it takes for signals to travel. Data bandwidth between components can be increased by stacking layers.

worldwide 3D IC and 2.5D IC packaging market The scale will reach US$55.17 billion in 2023 and is expected to reach approximately US$169.92 billion by 2034, with a compound annual growth rate of 10.85% during the forecast period from 2024 to 2033.

How can AI improve the 3D IC and 2.5D IC packaging industry?

Artificial intelligence can help find and create new materials to improve IC packaging performance and reliability. Artificial intelligence (AI) can find interesting new material candidates by evaluating performance data and material properties. The 3D and 2.5D IC packaging industry can achieve better performance, higher efficiency and higher quality by leveraging artificial intelligence, which will stimulate more innovation and growth in this field.

Growing demand for consumer electronics

Rapid industrialization and urbanization have driven strong demand for consumer electronics and encouraged the development of new products used in daily life. Continuous innovation in electronics has resulted in new and improved devices with enhanced features, performance, and functionality. This drives consumers to upgrade to the latest technology. The growing trend of streaming services, gaming and other digital media has expanded the demand for high-quality consumer electronics such as televisions, audio systems and game consoles. Demand for smartphones, tablets, and other portable devices continues to grow as they become essential tools for communication, work, and entertainment. Demand is fueled by the proliferation of the Internet of Things (IoT) and smart devices, which have given rise to an expanding ecosystem of connected electronics, from smart homes to wearable technology.

Increase efforts in smart infrastructure and smart city projects

Due to the rapid development of the automobile industry and the goal of reducing carbon dioxide emissions, electric vehicles are adopted by most people. Smart infrastructure and smart city projects are increasingly becoming the focus of urban development and modernization. Advance Intelligent Transportation Systems (ITS) to improve traffic management, reduce congestion and enhance public transportation through real-time data and connectivity.

3D WLCSP will lead the market in 2023

In 2023, the 3D wafer-level chip-scale packaging (WLCSP) segment will dominate the 3D IC and 2.5D IC packaging market.

• 3D Wafer Level Chip Scale Packaging (WLCSP) enables very compact packaging, which is critical for modern electronic devices that require smaller and lighter components. By stacking chips vertically, it shortens the distance between components, shortening signal paths and increasing performance and speed.
• 3D wafer-level chip-scale packaging (WLCSP) can integrate advanced cooling technologies to help manage heat more effectively in densely packed circuits. It supports a high level of integration, including combining different types of chips (e.g., logic, memory) in a single package, which benefits complex applications and systems. Short interconnects between chips reduce parasitic capacitance and inductance, improving signal integrity and reducing power consumption and development costs.

MEMS/sensors will demonstrate significant market share in 2023

By 2023, the MEMS/sensor field will account for a significant share of the 3D IC and 2.5D IC packaging markets. MEMS and sensors often require integration with other electronic components (e.g. signal processing units, power management circuits). 3D IC and 2.5D IC packaging enable compact, high-density integration, minimizing overall footprint and enabling more compact device designs. Microelectronics, microactuators and microsensors are the functional parts of MEMS.

Asia tech hub develops 79% to support dominance

In 2023, the Asia-Pacific region will dominate the global 3D IC and 2.5D IC packaging market. The Asia-Pacific region is home to leading semiconductor manufacturers and foundries such as Samsung and Taiwan Semiconductor Manufacturing Company (TSMC).

More than 89% of Japan’s GDP is created by the automobile industry. Japan is actually the third largest car manufacturing country in the world! However, Japan has not embraced zero-emission vehicles (ZEV) as quickly as several other Asian countries. As the world transitions faster to zero-emission vehicles, Japan’s economic stability will be affected by the success or failure of its auto industry. This will have significant implications for Japan’s still-emerging role in the changing global electric vehicle landscape.

North America’s technology leadership drives growth

North America is expected to be the fastest growing 3D IC and 2.5D IC Packaging market in the next few years. North America, particularly the United States, is home to major technology and semiconductor companies such as Intel, AMD, and NVIDIA, which are leaders in the development and adoption of advanced packaging technologies, including 3D IC and 2.5D IC. North America has a well-established ecosystem of leading packaging technology providers, materials suppliers and equipment manufacturers supporting the growth and adoption of advanced packaging solutions.

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About the author

Asmita Singh is a renowned author and consultant to the packaging industry, known for her strong passion for knowledge discovery and commitment to delivering actionable insights. With extensive experience in implementing advanced research methodologies, Asmita generates high-quality data and meaningful results, driving innovation and efficiency in packaging solutions. Her expertise spans the globe, providing valuable consulting services to businesses aiming to enhance their packaging strategies. Asmitas’ work is characterized by a commitment to excellence and a keen understanding of the latest trends and technologies shaping the future of packaging.