Silicon photonic chips for quantum computing need stable
Silicon photonic chips used for quantum computing operate at temperatures of several kelvins. This makes it challenging to connect the necessary single-mode optical fibers. Typical epoxy bonding methods cannot create a stable connection, especially when multiple cooling cycles are required. Selective laser soldering provides a more robust connection that withstands repeated temperature cycles. The VersaSolder system from nanosystec is ideal for connecting multiple optical fibers to this type of silicon photonic chip. Two optical heads focus the laser beam to the connection point and re-solder the solder. After the laser power is reduced, the solder cools and forms a stable connection. The symmetrical configuration with two simultaneous beams avoids misalignment during assembly. Compared to epoxy gluing, the laser welding method saves time because placing the fiber and welding takes only a few seconds. Therefore, laser welding can also achieve higher production throughput. The VersaSolder system has a modular architecture and can be configured to meet the requirements of specific process…
FA+FSI of Silicon Photonics Modules
HYC provides a series of high-precision fiber array (FA) products for high-speed optical module parallel transmission solutions. Fiber array + isolator and fiber array + lens are widely used in 400G/800G silicon photonics high-speed optical modules. The main process is to bond the isolator to the FA fiber end face, making the optical path irreversible, the return loss can reach more than 32dB, the product performance meets the reliability GR1221&168H PCT, and the shear force meets the MIL-STD-883G standard. HYC will display these products at booth #D65 at ECOC2024. hyc-system.com
FA+FSI of Silicon Photonics Modules
HYC provides a series of high-precision fiber array (FA) products for high-speed optical module parallel transmission solutions. Fiber array + isolator and fiber array + lens are widely used in 400G/800G silicon photonics high-speed optical modules. The main process is to bond the isolator to the FA fiber end face, making the optical path irreversible, the return loss can reach more than 32dB, the product performance meets the reliability GR1221&168H PCT, and the shear force meets the MIL-STD-883G standard. HYC will display these products at booth #D65 at ECOC2024. hyc-system.com
North American Internet of Things Technology Expo returns to Silicon Valley
IoT Technology Expo North America will return to the Santa Clara Convention Center in California on June 5-6, 2024. With 7,000 attendees expected, 250 exhibitors and 200 speakers, the event is a big moment for CEOs, senior managers and technology enthusiasts.Produced by TechEx Events, the conference will showcase six concurrent events including the AI & Big Data Expo, Unified Communications Conference, Intelligent Automation Conference, Cybersecurity & Cloud Conference, Digital Transformation Week and Edge Computing Expo. This convergence provides attendees with a unique opportunity to gain in-depth insights into the latest technology trends shaping the industry.The choice of Silicon Valley as the host location for this event was deliberate, as it is the global epicenter of technological innovation. The region is home to numerous technology companies, startups, and influencers, providing an ideal environment for networking and collaboration. IoT Tech Expo North America will provide an immersive experience, allowing participants to explore cutting-edge developments and build connections in a vibrant tech community.The…
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